For use with Electroless Copper Plating Hardware Kit (Cat. No. 41600B)

This kit is a key component of the MG Chemicals Professional Prototyping Process, which allows professional electronic engineers to prototype circuit boards with copper plated through holes themselves, avoiding having to send their designs to prototyping companies.

In the prototyping process, after drilling and de-burring the through holes in the copper clad board, the holes must be “activated” before they can be electroplated with a normal copper electroplating process. Through-hole activation entails making the walls of the through holes conductive, because only conductive surfaces can be electroplated. The electroless plating process achieves this by applying a thin layer of copper to the inside of every hole. This layer is not sufficient to carry the circuit in the completed circuit, but it is enough to electroplate. An approximate 200 microinches of copper can be deposited using electroless copper plating solution.

Some of the chemicals in this process pose significant safety hazards and disposal challenges; and for that reason this process is for professional use only.

See the instructions for the MG Chemicals Professional Prototyping Process to understand the entire prototyping procedure.

This kit contains sufficient chemicals to plate through-holes on five 5” x 3” double sided copper clad boards (150 inches total surface area). Once mixed, solutions last for two days.

Kit Contents:

• 1 x Alkaline Cleaner  (Cat. No. 41601-250ML)
• 1 x Micro Etch Part A   (Cat. No. 41602-250ML)
• 1 x Micro Etch Part B   (Cat. No. 41603-250G)
• 2 x Catalyst Part A  (Cat. No. 41604-1L)
• 1 x Catalyst Part B  (Cat. No. 41605-250ML)
• 1 x Accelerator  (Cat. No. 41606-250ML)
• 1 x Plating Solution Part A  (Cat. No. 41607-250ML)
• 1 x Plating Solution Part B  (Cat. No. 41608-250ML)
• 1 x Plating Solution Part C  (Cat. No. 41609-250ML)

Read the complete instructions for the Electroless Copper Plating Process.

Catalog Number Description 41600A Kit